| 摘要 |
In a teeter-totter type MEMS accelerometer, the teeter-totter proof mass and the bottom set of electrodes (i.e., underlying the proof mass) are formed on a device wafer, while the top set of electrodes (i.e., overlying the teeter-totter proof mass) are formed on a circuit wafer that is bonded to the device wafer such that the top set of electrodes overlie the teeter-totter proof mass. The electrodes formed on the circuit wafer may be formed from an upper metallization layer on the circuit wafer, which also may be used to form various electrical connections and/or bond pads. |
