| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus that can optimize the arrangement of a target and a substrate during film formation even in various targets.SOLUTION: A sputtering apparatus 100 includes: a substrate holder 131 having a substrate receiving surface where a substrate 130 is placed; and a mask assembly 109A having an opening 113 provided between a target 102 and the substrate holder 131. The mask assembly 109A is provided with first and second masking parts 110 and 111 that are arranged parallel to the substrate holder 131, and the opening 113 is formed between the sides facing the first and second masking parts 110 and 111 each other. The first and second masking parts 110 and 111 are disposed so as to be independently movable in a direction perpendicular to the long side of the target 102, or in a direction parallel to the substrate receiving surface. |
