| 摘要 |
PROBLEM TO BE SOLVED: To provide a probing stage for a semiconductor wafer capable of reducing damage to a wafer caused by a probe, a semiconductor inspection device equipped with the stage, and a method of determining a stage groove width.SOLUTION: The probing stage for semiconductor wafer is so constituted that a mounting surface 2 of a stage 10 that mounts, sucks, and holds a thin film semiconductor wafer 70 is formed with a plurality of grooves 3 connected to a sucking device 20, and a groove width of each groove 3 is such a width as to shear-destroy the thin film semiconductor wafer by a shear span ratio. |
