| 摘要 |
PROBLEM TO BE SOLVED: To restrain the occurrence of a poor connection between the electrode and wire of a semiconductor light-emitting element.SOLUTION: A light-emitting device manufacturing method includes: a die bond step (steps 201) in which a semiconductor light-emitting element including a laminated semiconductor layer containing a luminous layer which emits light upon current conduction and an electrode having a metal layer composed of an Au-containing metal material and formed on the laminated semiconductor layer and a coating layer composed of an Ni- or Ta-containing material to coat the metal layer, the coating layer being set to less than 100 nm in thickness and an exposed surface being formed therein through which the coating layer is exposed to the outside, is mounted on a bonding object member via silicon resin-containing adhesive in such a way that its surface on a side opposite to the exposed surface faces the bonding object member, and then the adhesive is heated to bond the semiconductor light-emitting element to the bonding object member; and a wire bond step (step 203) in which a wire is connected to the exposed surface for the electrode of the semiconductor light-emitting element bonded to the bonding object member. |
