发明名称 |
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames. |
申请公布号 |
US2013337613(A1) |
申请公布日期 |
2013.12.19 |
申请号 |
US201313973644 |
申请日期 |
2013.08.22 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM KWANG SOO;LEE YOUNG KI;CHOI SEOG MOON;SON JIN SUK |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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