| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for polishing an optical device wafer, capable of reducing man-hours required for re-polishing after a polishing failure.SOLUTION: A method for polishing a wafer comprises the steps of: holding the wafer (step ST1); feeding polishing means to polish the wafer and measuring a load current value of a motor of the polishing means (steps ST2 and ST3); determining whether or not the measured load current value of the motor falls below a target load current value (step ST4); determining whether or not a value obtained by integrating the difference between the target load current value and the load current value of the motor during polishing by time reaches a prescribed criterion (steps ST6 and ST7); and separating the polishing means from the wafer and returning to the step ST2 for re-polishing the wafer (step ST8). |
