CURABLE COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a curable composition for optical semiconductor device, capable of enhancing the toughness and hardness of a cured product and minimizing the unevenness in shape of the cured product.SOLUTION: A curable composition for optical semiconductor device includes: a first organopolysiloxane represented by formula (1) and having an alkenyl group and a methyl group attached to silicone atom; a second organopolysiloxane represented by formula (51) and having a hydrogen atom attached to silicone atom and a methyl group attached to silicone atom; and a hydrosilylation catalyst. The first organopolysiloxane has a structural unit in which one phenyl group, one methyl group and two oxygen atoms are attached to one silicone atom. The content ratio of the methyl group attached to silicone atom in each of the first and second organopolysiloxanes is 80 mol% or more.