发明名称 |
ABATEMENT AND STRIP PROCESS CHAMBER IN A DUAL LOADLOCK CONFIGURATION |
摘要 |
Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume. |
申请公布号 |
US2013337655(A1) |
申请公布日期 |
2013.12.19 |
申请号 |
US201214002087 |
申请日期 |
2012.02.29 |
申请人 |
LEE JARED AHMAD;SALINAS MARTIN JEFFREY;REUTER PAUL B.;YOUSIF IMAD;PAL ANIRUDDHA;APPLIED MATERIALS, INC. |
发明人 |
LEE JARED AHMAD;SALINAS MARTIN JEFFREY;REUTER PAUL B.;YOUSIF IMAD;PAL ANIRUDDHA |
分类号 |
H01L21/3065;H01L21/67 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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