| 摘要 |
<p>Provided are: a ceramic wiring board having little burr in the vicinity of the notched section of the side surface of the main board body, and superior solder mounting properties of a conductor layer provided to the inner wall surface of the notched section; a multi-pattern ceramic wiring board for obtaining a plurality of boards; and a method for producing that reliably obtains the wiring board. The ceramic wiring board (1a) is provided with: a main board body (2a) provided with a front surface (3) and rear surface (4) that are rectangular in a plan view, and a side surface (5) that is positioned between the front surface (3) and the rear surface (4) and that has a grooved surface (8a) on the front surface (3) side and a cut surface (7) on the rear surface (4) side; and a notched section (6) that is concave in a plan view and that is between the front surface (3) and the rear surface (4) in at least one of the side surfaces (5). In the side surface (5) having the notched section (6), the border line (11) between the grooved surface (8a) and the cut surface (7) has a curved section (11r) that, on both sides of the notched section (6), forms a protrusion from the front surface side (3) of the main board body (2a) in a lateral view.</p> |
