RESIN COMPOSITION FOR INSULATION, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD

摘要

The present invention relates to a resin composition comprising cellulose nanoparticles or cellulose nanofiber; liquid crystal oligomers or liquid crystal thermoset soluble oligomers; epoxy resin; and an inorganic filler, to a insulating film manufactured by using the same, to prepreg and to a printing circuit board. The resin composition, the insulating film and prepreg of the present invention have low coefficient of thermal expansion, high glass transition temperatures and high stiffness.