发明名称 MARKING METHOD OF SEMICONDUCTOR ELEMENT, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a marking method of a semiconductor element which allows for efficient manufacture of a semiconductor device even when marking every semiconductor element, and to provide a manufacturing method of a semiconductor device.SOLUTION: A method of marking a semiconductor element inserted into the pocket of a carrier that can be taken up in reel-shape is provided. The manufacturing method of a semiconductor device includes step 1 for inserting a semiconductor element into the pocket of a carrier that can be taken up in reel-shape, and step 2 for marking the semiconductor element inserted into the pocket.
申请公布号 JP2013254865(A) 申请公布日期 2013.12.19
申请号 JP20120130036 申请日期 2012.06.07
申请人 NITTO DENKO CORP 发明人 TAKAMOTO HISAHIDE;SHIGA GOSHI
分类号 H01L23/00;H01L21/60 主分类号 H01L23/00
代理机构 代理人
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