发明名称 |
MARKING METHOD OF SEMICONDUCTOR ELEMENT, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a marking method of a semiconductor element which allows for efficient manufacture of a semiconductor device even when marking every semiconductor element, and to provide a manufacturing method of a semiconductor device.SOLUTION: A method of marking a semiconductor element inserted into the pocket of a carrier that can be taken up in reel-shape is provided. The manufacturing method of a semiconductor device includes step 1 for inserting a semiconductor element into the pocket of a carrier that can be taken up in reel-shape, and step 2 for marking the semiconductor element inserted into the pocket. |
申请公布号 |
JP2013254865(A) |
申请公布日期 |
2013.12.19 |
申请号 |
JP20120130036 |
申请日期 |
2012.06.07 |
申请人 |
NITTO DENKO CORP |
发明人 |
TAKAMOTO HISAHIDE;SHIGA GOSHI |
分类号 |
H01L23/00;H01L21/60 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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