| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition which exerts high heat resistance, and has rapid curability while maintaining storage stability.SOLUTION: A curable resin composition contains: 10-250 pts.mass of a curable silicone resin (B), which has a main chain composed of a polyoxyalkylene and has a nitrogeneous characteristic group and a cross-linkable silyl group in each molecule; and 0.001-1.0 pts.mass of a boron halide compound (C) in terms of boron halide, relative to 100 pts.mass of a curable silicone resin (A), which has a main chain composed of a vinyl monomer produced by polymerizing at least one monomer selected from the group consisting of (meth)acrylic monomer, acrylonitrile monomer, aromatic vinyl monomer and fluorine-containing vinyl monomer, with the polymerization method thereof being a living radical polymerization method, and has a cross-linkable silyl group at a molecular terminal. |
