COPPER FOIL WITH CARRIER, METHOD OF MANUFACTURING COPPER FOIL WITH CARRIER, COPPER FOIL WITH CARRIER FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a copper foil for a printed wiring board that can improve adhesive strength between the copper foil and resin by improving a roughened layer of the copper foil, and a method of manufacturing the same.SOLUTION: There is provided a copper foil for a printed wiring board that has, at least on one surface of the copper foil, a roughened layer of the copper foil such that an average diameter D1 of a particle bottom at a position of 10% in particle length is 0.2-1.0 μm, and a ratio L1/D1 of the average diameter D1 at the particle bottom to the particle length L1 is 15 or less. There is provided a copper foil for a printed wiring board such that the total of area that holes of a resin-roughened surface having ruggedness occupy is 20% or larger on a surface of the resin having a copper layer etched away after the copper foil for printed wiring having the roughened layer and the resin are laminated. There is provided a copper foil for a semiconductor package substrate which avoids a circuit corrosion phenomenon without making other various characteristics of the copper foil worse.