发明名称 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 A wiring board includes a core layer; a through hole penetrating through the core layer in a thickness direction of the core layer; and an electronic part accommodated inside the through hole, wherein the through hole includes a first opening portion provided on a first surface of the core layer, a second opening portion provided on a second surface of the core layer, and an inward protruding portion inwardly protruding relative to the first and second opening portions, and wherein the electronic part is held by the inward protruding portion.
申请公布号 US2013333930(A1) 申请公布日期 2013.12.19
申请号 US201313914894 申请日期 2013.06.11
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 KOYANAGI TAKAAKI
分类号 H05K1/18;H05K3/30 主分类号 H05K1/18
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