发明名称 LED PACKAGE AND METHOD FOR PRODUCING THE SAME
摘要 <p>LED ("light emitting diode") package (1) comprising a substrate (2) with a top side (9) and a bottom side (10), and at least one LED die (4), the substrate (2) having circuitry (3) arranged on its bottom side (10), the at least one LED die (4) comprising a bottom surface (6) exhibiting at least two separated contact areas (7, 8) for electrical connection. In order to realise an LED package (1) with mechanically robust electrical connections that can be simultaneously produced, according to the present invention, it is provided that the at least one LED die (4) is at least partially arranged in the substrate (2), and that at least one of the at least two contact areas (7, 8) is electrically connected to the circuitry (3) by a contact electrode (11) consisting of a film of conductive material (22).</p>
申请公布号 WO2013185836(A1) 申请公布日期 2013.12.19
申请号 WO2012EP61442 申请日期 2012.06.15
申请人 SFERRUM GMBH;ALEXEEV, ANDREI;POPPER, SERGEY 发明人 ALEXEEV, ANDREI;POPPER, SERGEY
分类号 H01L33/48;H01L33/38 主分类号 H01L33/48
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