| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating bath, which is free from boric acid used as a pH buffer, has a low nickel content, and can be provided as a condensed solution.SOLUTION: An electroless plating bath 1 includes: copper sulfide hemihydrate 0.03 M; nickel sulfide 0.01 M; trisodium citrate 0.06 M as a complexing agent; sodium hypophosphite 0.18 M as a reducing agent, sodium carbonate 0.25 M as a buffer; lithium hydroxide as a pH adjuster, and a surfactant and the like which are not essential. |
