ADHESIVE COMPOSITION, FILM ADHESIVE AND CIRCUIT CONNECTING MATERIAL USING THE ADHESIVE COMPOSITION, CONNECTION STRUCTURE FOR CIRCUIT MEMBER, AND METHOD FOR PRODUCTION OF THE CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition that can obtain sufficient adhesive strength even to either adherend configured by an inorganic material or organic material and can obtain the stable adhesive strength even under high-temperature high-humidity environment.SOLUTION: There is provided an adhesive composition containing (A) an organoaluminum complex, (B) a silane coupling agent, (C) a curable component, and (D) a compound having a urethane group and ester group in a molecule.