发明名称 LASER BEAM-MACHINING APPARATUS AND LASER BEAM-MACHINING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laser beam-machining apparatus and a laser beam-machining method, which enable surface roughness in three-dimensional machining to be more reduced.SOLUTION: A machining area is set in such a way that a plurality of machining layers are stacked in a laser beam irradiation direction. Lattice points of an imaginary triangular lattice having been set with respect to the machining layers are used as pulse irradiation points and the machining layers are irradiated with laser beam to be machined. The machining area includes at least one period of machining layers, the one period comprising three continuous layers from a first layer to a third layer in machining order, out of the plurality of machining layers. In the second layer, pulse irradiation points are formed by shifting lattice points of a triangular lattice to one gravity center G1 out of adjacent gravity centers of two triangles T1 formed by connecting three adjacent pulse irradiation points P1 of the first layer. In the third layer, pulse irradiation points P3 are formed by shifting lattice points of the triangular lattice to the other gravity center of the two adjacent triangles T1.
申请公布号 JP2013252529(A) 申请公布日期 2013.12.19
申请号 JP20120128445 申请日期 2012.06.05
申请人 MITSUBISHI MATERIALS CORP 发明人 KUBO TAKUYA;TAKAHASHI MASAKUNI;HIGANO SATORU
分类号 B23K26/00;B23K26/04 主分类号 B23K26/00
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