发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME |
摘要 |
A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate. |
申请公布号 |
US2013334681(A1) |
申请公布日期 |
2013.12.19 |
申请号 |
US201213525460 |
申请日期 |
2012.06.18 |
申请人 |
HSIEH CHIN-TANG;KUO CHIH-MING;TU CHIA-JUNG;CHANG SHIH-CHIEH;NI CHIH-HSIEN;HO LUNG-HUA;WU CHAUN-YU;LIN KUNG-AN;CHIPBOND TECHNOLOGY CORPORATION |
发明人 |
HSIEH CHIN-TANG;KUO CHIH-MING;TU CHIA-JUNG;CHANG SHIH-CHIEH;NI CHIH-HSIEN;HO LUNG-HUA;WU CHAUN-YU;LIN KUNG-AN |
分类号 |
H01L23/488;H01L21/56 |
主分类号 |
H01L23/488 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|