| 摘要 |
<p>This composite multilayer wiring board has: a plurality of intermediate wiring board sections; a connecting layer, outermost insulating layers, and outermost layer wiring; and outermost layer vias. Each of the intermediate wiring board sections has wiring of four or more layers, said wiring including first upper wiring and second lower wiring of an inner layer, and second upper wiring on the first surface of surface layers, and second lower wiring on the second surface of the surface layers. A connecting layer has a connecting insulating layer containing a core material, and connection vias, i.e., paste vias. The outermost layer wiring is formed on the outer sides of the outermost insulating layers. Each of the outermost layer vias penetrates each of the outermost insulating layers, and electrically connects the outermost layer wiring and the second upper wiring or the second lower wiring to each other. Each of the outermost insulating layers has the second upper wiring or the second lower wiring embedded therein, said second upper wiring and the second lower wiring facing the outermost insulating layers, respectively.</p> |
