COOLING-HEATING APPARATUS OF SEMI-CONDUCTOR LIQUID

摘要

Disclosed is a device for cooling and heating a semiconductor processing solution. The device for cooling and heating the semiconductor processing solution comprises a chamber which is filled with a fluorine resin plate; a cover member which covers both sides of the chamber; a protective plate which is laminated on the cover member; a cooling-heating module which is connected to the protective plate; a plurality of horizontal plates which divides the chamber and is arranged to be separated to each other; a vortex rib which is protruded from a horizontal plate; and penetration holes which is formed in the horizontal plates and is formed in a zigzag shape.