| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition capable of sufficiently filling a gap between circuit members and giving a cured product excellent in heat resistance, a semiconductor device using such a resin composition, a multilayer circuit board, and an electronic component.SOLUTION: A resin composition, which is used to bond circuit members to each other and to electrically connect circuit electrodes of the respective circuit members together, has a flux function. The resin composition includes a thermosetting resin, a compound having a carboxyl group and/or a phenolic hydroxyl group, and an acid anhydride. Preferably, a content of the acid anhydride is 0.1-50 mass%, and its lowest melt viscosity at 25-250°C is ≤10,000 Pa s. |
