发明名称 |
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURING THE SAME |
摘要 |
An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip. |
申请公布号 |
US2013334683(A1) |
申请公布日期 |
2013.12.19 |
申请号 |
US201213618813 |
申请日期 |
2012.09.14 |
申请人 |
KIM SEUNG JEE;CHUNG QWAN HO;NAM JONG HYUN;KIM SI HAN;LEE SANG YONG;SHIN SEONG CHEOL;SK HYNIX INC. |
发明人 |
KIM SEUNG JEE;CHUNG QWAN HO;NAM JONG HYUN;KIM SI HAN;LEE SANG YONG;SHIN SEONG CHEOL |
分类号 |
H01L23/48;H01L21/60 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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