发明名称 LASER PROCESSING MACHINE, LASER CUTTING MACHINE, AND METHOD FOR ADJUSTING A FOCUSED LASER BEAM
摘要 Laser processing machines and methods for adjusting focused laser beams. Laser processing heads have nozzle with openings admitting primary laser beam. An orientation device is included, as well as at least one sensor to mutually center primary beam and opening of nozzle. A first beam handling unit is arranged near the nozzle opening and may convert primary beam into a secondary wide-band heat beam, and then may emit this secondary beam towards a sensor; or may reflect/scatter at least a portion of the primary beam towards sensor. The sensor detecting the converted secondary beam is arranged within the laser processing head. In an adjustment process, a primary beam may be converted into a wide-band heat radiation as secondary radiation at the beam handling unit, and emitted and/or diverted into a scattered/reflex beam towards the sensor. Respective position of nozzle opening center and primary beam is calculated from sensor-measured values, and nozzle center and beam center are automatically displaced to mutual center. The axial position of beam focus may be also be measured and set via the nozzle centering procedure.
申请公布号 US2013334181(A1) 申请公布日期 2013.12.19
申请号 US201313947060 申请日期 2013.07.20
申请人 BYSTRONIC LASER AG 发明人 LUEDI ANDREAS;CATHRY DANIEL
分类号 B23K26/06;B23K26/02;B23K26/073 主分类号 B23K26/06
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