| 摘要 |
The present invention pertains to a microetching agent, a supplementary liquid to be added to said microetching agent, and a circuit board manufacturing method using said microetching agent. The microetching agent for copper comprises an aqueous solution containing copper (II) ions, organic acid, halide ions, a polymer, and a non-ionic surfactant. The polymer is water soluble, has a polyamine chain and/or a cationic group, and a weight-average molecular weight of at least 1000. In the microetching agent of the present invention, if the concentration of the halide ions is represented by A mass%, the concentration of the polymer is represented by B mass%, and the concentration of the nonionic surfactant is represented by D mass%, it is preferable that the value of A/B is 2000-9000, and the value of A/D is 500-9000. Using this etching agent, it is possible to uniformly maintain adhesion with a resin or the like, even with only a small amount of etching. |
