发明名称 Adapter For Plated Through Hole Mounting Of Surface Mount Component
摘要 A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.
申请公布号 US2013337697(A1) 申请公布日期 2013.12.19
申请号 US201213495671 申请日期 2012.06.13
申请人 BUSCHEL DANIEL J.;MA WAI MON;TERSIGNI JAMES E.;BIRCHALL RAYMOND D.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BUSCHEL DANIEL J.;MA WAI MON;TERSIGNI JAMES E.;BIRCHALL RAYMOND D.
分类号 H01R24/20 主分类号 H01R24/20
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