| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing material for an organic semiconductor element which avoids contact with an organic semiconductor element to be sealed, secures a gap between itself and the organic semiconductor element thereby maintaining excellent durability, and achieves excellent flexibility, and to provide an organic semiconductor element sealing body using the sealing material for the organic semiconductor element.SOLUTION: A sealing material 16 for an organic semiconductor element is used for sealing an organic semiconductor element between itself and a transparent substrate on which the organic semiconductor element is disposed. Drawing is performed to provide a drawing portion, which is recessed to a depth that enables the organic semiconductor element to be accommodated therein, at a center part 16b located at the inner side relative to a peripheral part 16a serving as a seal area to be sealed to the transparent substrate. An embossed portion, in which recessed parts 18a and protruding parts 20a are repeated in two or more directions, is provided in a ceiling part 16c of the drawing portion. |
