发明名称 CONDUCTIVE BINDER COMPOSITION, METAL WIRE WITH CONDUCTIVE BINDER, BONDED UNIT, AND SOLAR CELL MODULE
摘要 Provided is a conductive adhesive composition including: conductive particles (A) containing metal having a melting point of equal to or lower than 210° C.; a resin (B) having a softening point of equal to or lower than the melting point of the metal of the conductive particles and being solid at a room temperature; a flux activator (C); and a solvent (D).
申请公布号 US2013333744(A1) 申请公布日期 2013.12.19
申请号 US201213981820 申请日期 2012.01.11
申请人 YOKOCHI SEIGO;FUJITA MASARU;HAYASHI HIROKI;HITACHI CHEMICAL COMPANY, LTD. 发明人 YOKOCHI SEIGO;FUJITA MASARU;HAYASHI HIROKI
分类号 H01L31/02 主分类号 H01L31/02
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