| 摘要 |
A polyhydroxy polyether resin which is necessary for obtaining a resin composition for electronic circuit boards, said resin composition having excellent heat resistance, low water absorption, excellent electrical characteristics (in particular, low dielectric constant and low dielectric loss), excellent moldability, excellent flexibility, excellent impact resistance and excellent adhesion; and a resin composition for electronic circuit boards, which contains the polyhydroxy polyether resin as an essential component. The polyhydroxy polyether resin is characterized by having a weight average molecular weight of 10,000-200,000 and having constituent(s), namely an indenyl group and/or an alpha-methylbenzyl group. |
