HIGH FREQUENCY MODULE

摘要

The present invention eliminates breakage or the like of an IC chip embedded in a cavity in a multilayer substrate formed by laminating and thermocompression bonding sheets formed of a thermoplastic resin material. Disclosed is a high frequency module wherein an IC chip (25) is embedded in a cavity (20) that is provided in a multilayer substrate (10) formed by laminating and thermocompression bonding a plurality of sheets (11a-11g) formed of a thermoplastic resin material. A gap (G) is provided between the side surfaces of the IC chip (25) and the inner wall portions of the cavity (20). The multilayer substrate (10) is provided with a via hole conductor (17), which prevents the resin sheets from flowing into the cavity (20) due to softening of the resin sheets at the time of thermocompression bonding the resin sheets, said via hole conductor being adjacent to the inner wall portions of the cavity (20).