| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which obtains an independent circuit of a plating film with simple processes.SOLUTION: In a manufacturing method of a wiring board, a plating base film 13 is formed on a surface 12 of an insulative base material 11 that will be a wiring board, and a predetermined region 14 in the plating base film 13 is removed by laser to define a circuit part 18 including a power supply pattern 17 and a circuit pattern 16. Electrolytic copper plating is performed to the circuit pattern 16 through the power supply pattern 17. Then, the power supply pattern 17 and the circuit pattern 16 are divided by the laser. Electroless gold plating 22 is performed to the circuit pattern 16 after electroless nickel plating 21 is performed thereto, thereby configuring the circuit pattern 16 as an independent circuit 23. Further, electroless copper plating may be performed to the circuit pattern 16 before the electroless nickel plating 21 is performed. |
