| 发明名称 |
A REACTIVE HOT-MELT ADHESIVE FOR USE ON ELECTRONICS |
| 摘要 |
The disclosure relates to a method of making an electronic assembly with a reactive hot-melt adhesive composition that include an atmospheric curing prepolymer and optionally a thermoplastic component with a softening point of at least about 120°C, and the electronic assembly made therewith. |
| 申请公布号 |
WO2013016130(A3) |
申请公布日期 |
2013.12.19 |
| 申请号 |
WO2012US47383 |
申请日期 |
2012.07.19 |
| 申请人 |
H.B. FULLER COMPANY;GIORGINI, ALBERT, M.;HILLEY, ANDREW |
发明人 |
GIORGINI, ALBERT, M.;HILLEY, ANDREW |
| 分类号 |
C09J5/00;B32B27/00;C08G18/10;C09J175/04;H01L21/50;H01L21/67;H01L23/00;H01L23/10;H01L23/31 |
主分类号 |
C09J5/00 |
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