发明名称 |
Method And System For Improved Matching For On-Chip Capacitors |
摘要 |
Methods and systems for improved matching of on-chip capacitors may comprise a semiconductor die with an on-chip capacitor comprising one or more metal layers. The on-chip capacitor may comprise interdigitated electrically coupled metal fingers. The electrically coupled metal fingers may be arranged symmetrically in the semiconductor die to compensate for non-uniformities in the one or more metal layers. The metal fingers may be arranged with radial symmetry. Metal fingers in a first metal layer may be electrically coupled to metal fingers in a second metal layer. An orientation of metal fingers may be alternated when coupling metal fingers in a plurality of metal layers. The metal fingers may be coupled at the center or the outer edge of the on-chip capacitor. The on-chip capacitor may be configured in a plurality of symmetric sections wherein a boundary between each of the plurality of sections is configured in a zig-zag pattern. |
申请公布号 |
US2013334658(A1) |
申请公布日期 |
2013.12.19 |
申请号 |
US201313917147 |
申请日期 |
2013.06.13 |
申请人 |
CAI WEIZHONG;IMURA KIMIHIKO;GU WEI |
发明人 |
CAI WEIZHONG;IMURA KIMIHIKO;GU WEI |
分类号 |
H01L49/02 |
主分类号 |
H01L49/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|