发明名称 |
INSULATING EPOXY RESIN COMPOSITION, INSULATING FILM MANUFACTURED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME |
摘要 |
Disclosed herein are an insulating resin composition, an insulating film manufactured therefrom, and a multilayer printed circuit board, and more specifically, in a build-up manner of multilayer printed circuit board, an insulating epoxy resin composition including a liquid crystal oligomer or the like capable of decreasing a dissipation factor, a dielectric constant, and a coefficient of thermal expansion, an insulating film manfuactured by using the insulating epoxy resin composition, and a multilayer printed circuit board having multiple layers obtained by allowing inner circuits formed of copper (Cu) to be insulated by using the insulating film. |
申请公布号 |
US2013337268(A1) |
申请公布日期 |
2013.12.19 |
申请号 |
US201213584727 |
申请日期 |
2012.08.13 |
申请人 |
JEON KEE SU;SHIM JI HYE;LEE SA YONG;KIM JIN YOUNG;LEE JEONG KYU;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JEON KEE SU;SHIM JI HYE;LEE SA YONG;KIM JIN YOUNG;LEE JEONG KYU |
分类号 |
C08L63/04;B32B27/38;C08L61/16;C08L63/02;C08L67/03;C08L69/00;C08L71/00;C08L79/08;C08L81/06 |
主分类号 |
C08L63/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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