| 摘要 |
A flip-chip bonding device (500) for layer-bonding a second-layer semiconductor chip (30), on which a second through electrode is provided, to a first-layer semiconductor chip (20), on which a first through electrode is provided, at a position corresponding to the first through electrode, and equipped with a control unit (50), and a double-view camera (16) for capturing images of the semiconductor chips (20, 30), wherein the control unit (50) is provided with a relative-position detection program (53) for detecting the relative positions of the semiconductor chips (20, 30) in the layer-bonded layers, on the basis of an image of the first through electrode on the surface of the first-layer semiconductor chip (20) captured by the double-view camera (16) prior to the layer-bonding, and an image of the second through electrode on the surface of the second-layer semiconductor chip (30) captured by the double-view camera (16) after the layer-bonding. Consequently, through electrodes can be accurately connected by using a simple method. |
