| 摘要 |
An Sn-plated copper alloy material comprising, by mass, 2 to 12% Zn, 0.1 to 1.0% Sn, optionally 0.005 to 0.5%, in total, at least one member selected from among Ni, Mg, Fe, P, Mn, Co, Be, Ti, Cr, Zr, Al and Ag, and the balance copper and unavoidable impurities. The Sn-plated copper alloy material has a thermal conductivity of 150 to 260 W/(m K) and a micro Vickers hardness of 120 to 215 and has its surface covered with a pure Sn phase of 0.1 to 2.0 µm average thickness. Further, there is disclosed a printed board terminal being a pin-shaped member of 0.2 to 1.0 mm in thickness (t) of its part mounted on the board and 0.9t to 2.0tmm in width (w) of its part mounted on the board obtained by press working of the above alloy material so that the base material of the copper alloy material is exposed at a press fractured surface, thereby excelling in solder mountability. Thus, there is provided an Sn-plated copper alloy material that even when plating is performed prior to press working, excellent mountability is attained, and provided a printed board terminal obtained by working of the material. |
