发明名称 WATERPROOF STRUCTURE FOR CONDUCTION PATH
摘要 The present invention provides a waterproof structure for a conductive path which waterproofs a conductive path without imposing an unnecessary load on a conductor, and can sufficiently obtain a creepage distance. A plurality of grooves 9 is formed on the outer circumferential surface 8 of an insulator 7. The grooves 9 are formed to be hollow by heat or cutting. The grooves 9 are formed within a predetermined range L on the outer circumferential surface 8 of the insulator 7. This predetermined range L is set as a range in which an overmold part 5 is provided. The overmold part 5 is a seal member made of an elastomer, and is disposed and formed within the predetermined range L of an electric wire 2. Also, the overmold part 5 is formed to fill all of the three grooves 9.
申请公布号 EP2605337(A4) 申请公布日期 2013.12.18
申请号 EP20110816310 申请日期 2011.07.27
申请人 YAZAKI CORPORATION 发明人 ADACHI HIDEOMI;KUBOSHIMA, HIDEHIKO
分类号 H01R13/52;H01R13/58 主分类号 H01R13/52
代理机构 代理人
主权项
地址
您可能感兴趣的专利