发明名称 |
Method and paste for contacting metal surfaces |
摘要 |
The method for producing an electrically conductive or heat-conductive component (3a) for producing a metallic contact between two elements e.g. cooling bodies or solar cells (8), comprises forming an elemental silver from a silver compound between contact areas connecting one above the other. The silver compound is an organic silver compound or silver carbonate. The contact area comprises a base metal in the surface. The method is carried out at 400[deg] C. A paste containing the silver compound is applied on the contact area. Independent claims are included for: (1) a method for producing a fully flat metallic contact between a metallic connecting surface of an electronic component and a metallic connecting surface of a further component; and (2) a contacting paste. |
申请公布号 |
EP2042260(B1) |
申请公布日期 |
2013.12.18 |
申请号 |
EP20080016620 |
申请日期 |
2008.09.22 |
申请人 |
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG |
发明人 |
SCHMITT, WOLFGANG;DICKEL, TANJA;STENGER, KATJA |
分类号 |
B23K35/34;B22F1/00;B23K35/02;B23K35/30;H01L23/00 |
主分类号 |
B23K35/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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