发明名称 Method and paste for contacting metal surfaces
摘要 The method for producing an electrically conductive or heat-conductive component (3a) for producing a metallic contact between two elements e.g. cooling bodies or solar cells (8), comprises forming an elemental silver from a silver compound between contact areas connecting one above the other. The silver compound is an organic silver compound or silver carbonate. The contact area comprises a base metal in the surface. The method is carried out at 400[deg] C. A paste containing the silver compound is applied on the contact area. Independent claims are included for: (1) a method for producing a fully flat metallic contact between a metallic connecting surface of an electronic component and a metallic connecting surface of a further component; and (2) a contacting paste.
申请公布号 EP2042260(B1) 申请公布日期 2013.12.18
申请号 EP20080016620 申请日期 2008.09.22
申请人 HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG 发明人 SCHMITT, WOLFGANG;DICKEL, TANJA;STENGER, KATJA
分类号 B23K35/34;B22F1/00;B23K35/02;B23K35/30;H01L23/00 主分类号 B23K35/34
代理机构 代理人
主权项
地址