| 摘要 |
<p>A method for mounting an electronic component on a substrate with conductive paths sensitive to high temperatures, characterized by applying solder (113) on the contact terminals (112) of the electronic component (111), heating the electronic component (111) to a temperature of at least the melting point the solder (113) and pressing the electronic component (111) towards the substrate (101) with conductive paths (102) while continuing the heating of the electronic component (111) until the solder (113) is bond with the conductive paths (102), and then stopping the heating of the electronic component (111).</p> |
