发明名称
摘要 Disclosed is a substrate transfer apparatus wherein a Bernoulli chuck (9) is provided on a hand section (5), and has a suction surface which includes a chuck recessed section (45) that holds a substrate (W) without contact. A plurality of guide bodies (10) are provided on the hand section (5), and the guide bodies align the substrate (W) held by means of the Bernoulli chuck (9). The Bernoulli chuck (9) is provided with a plurality of nozzle holes (47) which generate negative pressure by blowing out compressed air to the inside of the chuck recessed section (45). The guide bodies (10) are disposed by being distributed such that the guide bodies surround the circumference of the suction surface. Before the Bernoulli chuck (9) starts to hold the substrate (W), the guide bodies (10) are moved by means of the hand section (5) such that the guide bodies are positioned outside of the outline of the substrate (W). Then, the substrate (W) held by the Bernoulli chuck (9) is rotated in one direction by means of the compressed air blown out from the nozzle holes (47), thereby receiving and aligning the side portion of the substrate (W) by means of the guide bodies (10).
申请公布号 JP5370664(B2) 申请公布日期 2013.12.18
申请号 JP20090206180 申请日期 2009.09.07
申请人 发明人
分类号 B65G49/07;B25J15/06;B65H3/14;H01L21/677;H01L21/68 主分类号 B65G49/07
代理机构 代理人
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