| 摘要 |
To be provided is a vacuum pump reducing the influence of thermal expansion of connector pins to prevent cracks in soldered parts while preventing damage to electronic elements. Pins 207 linearly expand with the heat accumulated in a bottom space 301. The bottom space 301 is heated quite easily since it is in a vacuum environment. A screw 235A is arranged near the left edge of an AMB control substrate 209. Since no screw is arranged on the right of the screw 235A, the AMB control substrate 209 is released toward the right. When the pins 207 expand with heat, the AMB control substrate 209 bends by an angle ¸2 from the screw 235A as a fulcrum, but this bend angle is gradual, which means that the possibility of causing cracks in solder connection parts between the AMB control substrate 209 and the pins 207 is extremely small. Since deforming pressure of the AMB control substrate 209 is reduced, influence on the electronic elements can be reduced correspondingly. |
