发明名称 A METHOD FOR HIGH VOLUME E-BEAM LITHOGRAPHY
摘要 <p>The present invention relates to a method for forming a pattern with e-beam lithography. The method includes receiving integrated circuit (IC) design layout data including polygon and prohibition patterns; modifying the prohibition patterns and the polygon by using EPC technology; striping the modified polygon as sub fields; converting the striped polygon into an e-beam recorder format data; and recording the polygon of the e-beam recorder format data in a substrate. Striping the modified polygon includes finding a prohibition pattern modified as a reference layer and stitching the polygon by avoiding stitching the modified prohibition pattern. [Reference numerals] (202) Receive IC design layout data;(204) Perform EPC (Electron Proximity Correction);(206) Stripe EPC-modified IC design data;(208) Execute an e-beam data process;(210) Record in a substrate regarding an e-beam recorder</p>
申请公布号 KR20130138065(A) 申请公布日期 2013.12.18
申请号 KR20120092213 申请日期 2012.08.23
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 WANG HUNG CHUN;LIN TZU CHIN;LIN CHIA CHI;CHENG NIAN FUH;CHEN JENG HORNG;HUANG WEN CHUN;LIU RU GUN
分类号 H01L21/027 主分类号 H01L21/027
代理机构 代理人
主权项
地址