发明名称 |
A METHOD FOR HIGH VOLUME E-BEAM LITHOGRAPHY |
摘要 |
<p>The present invention relates to a method for forming a pattern with e-beam lithography. The method includes receiving integrated circuit (IC) design layout data including polygon and prohibition patterns; modifying the prohibition patterns and the polygon by using EPC technology; striping the modified polygon as sub fields; converting the striped polygon into an e-beam recorder format data; and recording the polygon of the e-beam recorder format data in a substrate. Striping the modified polygon includes finding a prohibition pattern modified as a reference layer and stitching the polygon by avoiding stitching the modified prohibition pattern. [Reference numerals] (202) Receive IC design layout data;(204) Perform EPC (Electron Proximity Correction);(206) Stripe EPC-modified IC design data;(208) Execute an e-beam data process;(210) Record in a substrate regarding an e-beam recorder</p> |
申请公布号 |
KR20130138065(A) |
申请公布日期 |
2013.12.18 |
申请号 |
KR20120092213 |
申请日期 |
2012.08.23 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
WANG HUNG CHUN;LIN TZU CHIN;LIN CHIA CHI;CHENG NIAN FUH;CHEN JENG HORNG;HUANG WEN CHUN;LIU RU GUN |
分类号 |
H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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