| 摘要 |
<p>The assembly (101) has a housing (102) with a housing inner space (106) surrounding a housing wall (103) and comprising power converter components. A cooling structure (120) cools a power semiconductor module (111) that is arranged in the housing inner space. Another cooling structure (130) cools a housing cover of the housing of the power converter module. The cooling structures are connected with each other. The housing cover comprises cover upper and base parts e.g. pressure casting parts. An inner side of the housing cover comprises a cooling passage in a joined state.</p> |
