| 摘要 |
<p>A method for manufacturing a case (200) of an electronic device includes the following steps. First, a vacuum formed film (210a) is formed on a first mold (100), and the vacuum formed film (210a) has a first surface (214) and a second surface (216). Then, an electromagnetic shielding layer (220) is formed on the first surface (214). Afterwards, a patterned film (300) and the vacuum formed film (210a) are provided in the second mold (400), and an in-mold decoration injection molding process is performed to form a case body (200) between the second surface (216) and the patterned film (300).</p> |
