| 摘要 |
A substrate processing system comprises a shower head and a processing chamber including a pedestal which is separated from a plasma power source and a shower head and supports a substrate. A filter is connected between the shower head and the pedestal. A variable bleed current circuit connected between the filter and the pedestal changes bleed current. A controller is prepared to adjust a value of the bleed current, perform curve fitting based on the bleed current and DC self-bias voltage, and estimate at least one of an electrode area ratio, bohm current, and radio frequency (RF) in an electrode to which power is supplied. [Reference numerals] (20) Plasma;(200) Controller;(204) Film thickness estimation module;(208) Action parameter adjustment module |
