发明名称
摘要 PROBLEM TO BE SOLVED: To provide a laminated wiring board, wherein conductive parts of respective wiring boards are electrically connected with each other between a plurality of laminated wiring boards without providing through-holes. SOLUTION: The laminated wiring board 10 includes a base material 11 comprising a first region 11A and a second region 11B, a conductive part 12 provided on one side 11a of the base material 11, and a conductor 14 disposed on the conductive part 12 along the boundary line 15 of the base material 11 composed of the first region 11A and the second region 11B. The first region 11A and the second region 11B are bent at the boundary line 15 so that the conductive parts 12 face each other, and the first region 11A comes close to the second region 11B. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5371396(B2) 申请公布日期 2013.12.18
申请号 JP20080304309 申请日期 2008.11.28
申请人 发明人
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
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