发明名称 METHOD AND ARRANGEMENT FOR ATTACHING A CHIP TO A PRINTED CONDUCTIVE SURFACE
摘要 A chip is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip.
申请公布号 KR20130138264(A) 申请公布日期 2013.12.18
申请号 KR20137012356 申请日期 2010.10.14
申请人 STORA ENSO OYJ 发明人 MAIJALA JUHA;SIRVIOE PETRI
分类号 H05K13/04;H05K3/32 主分类号 H05K13/04
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