发明名称
摘要 The invention provides a conveying mechanism and a processing device, which are capable of shortening a conveying stroke during conveying of workpieces in a work zone between a box and workpieces, and realizing miniaturization. In a direction, namely in a direction from a receiving zone (A1) toward a work zone (A3), the conveying mechanism operates as follows: draw out a semiconductor chip (W) kept by a first clamping part (71) to a temporary placement zone (A2) from the receiving zone, and make a push-pull arm in the temporary placement zone pass by to the rear end side of the semiconductor chip, and push the semiconductor chip to the work zone via a second abutting part (75). In another direction, namely in a direction from the work zone to the receiving zone, the conveying mechanism operates as follows: draw out the semiconductor kept by a second clamping part (72) to the temporary placement zone from the work zone, make the push-pull arm in the temporary placement zone pass by to the rear end side of the semiconductor chip, and push the semiconductor chip to the receiving zone via a first abutting part (74).
申请公布号 JP5373517(B2) 申请公布日期 2013.12.18
申请号 JP20090211803 申请日期 2009.09.14
申请人 发明人
分类号 H01L21/677;B65G49/07;H01L21/301 主分类号 H01L21/677
代理机构 代理人
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