发明名称 |
Substrate treating method |
摘要 |
A substrate treating method for treating substrates with a treating liquid includes a deionized water cleaning step for supplying deionized water from an injection pipe and cleaning the substrates inside a cleaning tank with deionized water, then a replacing step for injecting a solvent from a solvent injector and replacing the deionized water with the solvent, a separating and removing step for switching a channel to a branch pipe and causing a separator to remove the deionized water from the treating liquid, and an adsorbing and removing step for switching the channel to another branch pipe and causing a deionized water remover to adsorb and remove the deionized water from the treating liquid. |
申请公布号 |
US8608864(B2) |
申请公布日期 |
2013.12.17 |
申请号 |
US201113178059 |
申请日期 |
2011.07.07 |
申请人 |
KIMURA MASAHIRO;TAKAHASHI HIROAKI;MAEGAWA TADASHI;HAYASHI TOYOHIDE;DAINIPPON SCREEN MFG. CO., LTD. |
发明人 |
KIMURA MASAHIRO;TAKAHASHI HIROAKI;MAEGAWA TADASHI;HAYASHI TOYOHIDE |
分类号 |
B08B3/00;B08B6/00;B08B7/04 |
主分类号 |
B08B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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