发明名称 Substrate treating method
摘要 A substrate treating method for treating substrates with a treating liquid includes a deionized water cleaning step for supplying deionized water from an injection pipe and cleaning the substrates inside a cleaning tank with deionized water, then a replacing step for injecting a solvent from a solvent injector and replacing the deionized water with the solvent, a separating and removing step for switching a channel to a branch pipe and causing a separator to remove the deionized water from the treating liquid, and an adsorbing and removing step for switching the channel to another branch pipe and causing a deionized water remover to adsorb and remove the deionized water from the treating liquid.
申请公布号 US8608864(B2) 申请公布日期 2013.12.17
申请号 US201113178059 申请日期 2011.07.07
申请人 KIMURA MASAHIRO;TAKAHASHI HIROAKI;MAEGAWA TADASHI;HAYASHI TOYOHIDE;DAINIPPON SCREEN MFG. CO., LTD. 发明人 KIMURA MASAHIRO;TAKAHASHI HIROAKI;MAEGAWA TADASHI;HAYASHI TOYOHIDE
分类号 B08B3/00;B08B6/00;B08B7/04 主分类号 B08B3/00
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