| 摘要 |
A circuit board includes a substrate having upper and lower sides, and first and second conductive vias extending between the upper and lower sides. The first and second conductive vias include circular outer profiles. The circuit board also includes a differential pair of conductive traces, which includes a first conductive trace having first upper and lower segments disposed on the upper and lower sides, respectively. The first upper and lower segments are electrically connected together through the first conductive via. The first upper segment is curved around the second conductive via such that the first upper segment follows the circular outer profile of the second conductive via. The differential pair of conductive traces also includes a second conductive trace having second upper and lower segments disposed on the upper and lower sides, respectively. The second upper and lower segments are electrically connected together through the second conductive via. The first upper segment crosses over the second lower segment. The second lower segment is curved around the first conductive via such that the second lower segment follows the circular outer profile of the first conductive via. |
